What never made it into the datasheet
The lost art of embedded development.
Reading the register when the stack trace lies. Knowing why the bus hangs after a reset, why the rail sags when the radio keys up, why the optimizer deleted your loop. Written down, one field manual at a time, before it’s forgotten.
- Tracks
- 10
- Modules
- 41
- Per track
- ₹4,999$99
Firmware has no margin for error. One wrong bit is all it takes.
It used to be learned at the bench.
This knowledge was passed from senior engineer to junior, one board bring-up at a time. Those engineers are retiring or moving on, vendor HALs hide the registers, and code generators write firmware without ever looking at the hardware. Fewer people know why things actually fail.
Embedded Institute writes that craft down. Each module takes one real problem, a write buffer that reports a fault three instructions late or an I2C slave holding SDA low after a reset, from symptom to root cause to a fix that holds in production. No compliance checklists, no video courses. Manuals you keep open at the bench.
Why it matters now
Without the fundamentals, AI-written firmware isn’t just messy. It’s risky.
A code assistant will write firmware that builds and passes a quick bench test. On a microcontroller, a wrong guess doesn’t throw an exception. It corrupts memory, locks up a bus or bricks a device in a customer’s hands, weeks later. You can only review what you understand.
-
Polls a status register in a loop
The register isn’t declared
volatile, so at-O2the compiler reads it once and the loop never exits. -
Calls an RTOS API from an interrupt
The interrupt priority is above the kernel’s syscall limit. Nothing fails on the bench; the scheduler’s lists corrupt under load in the field.
-
Writes to a peripheral during init
Its clock isn’t enabled yet. The write is ignored or raises a bus fault, depending on the part, and the stacked PC points somewhere else.
Every module ships with AI prompts
Ready-to-paste prompts for that module’s topic that make your code assistant check exactly what it tends to get wrong. The manual gives you the fundamentals; the prompts put AI to work on top of them, so it speeds you up instead of quietly adding risk.
Review this driver as a senior embedded engineer.
For every peripheral register access, check:
1. Is the register accessed through a volatile pointer?
2. Is the peripheral's clock enabled before the first access?
3. Does any ISR that calls RTOS APIs run at or below
configMAX_SYSCALL_INTERRUPT_PRIORITY?
List each violation with its line and the failure it would
cause on the target.The curriculum
10 tracks, 41 modules, written in order. Each track shows its tentative release quarter. Select any module to see its path and how to get it.
Track 1 · Writing now · Tentative Q4 2026
Compiler Internals, Memory Anatomy & Optimization Forensics
What the compiler and linker actually do to your code, and how to prove it from the disassembly.
Track 2 · Planned · Tentative Q4 2026
Hardware-Software Interconnects & Silicon Fault Physics
The bus, timing and analog effects behind peripheral bugs that firmware alone can’t explain.
Track 3 · Planned · Tentative Q1 2027
Real-Time Systems, Determinism & Execution Architectures
Bounding timing, eliminating jitter and keeping memory behavior predictable.
Track 4 · Planned · Tentative Q1 2027
Automated Testing & Register-Level Mocking on Bare Metal
Unit-testing firmware that talks directly to hardware registers.
Track 5 · Planned · Tentative Q2 2027
Headless CI/CD, Containerized Toolchains & Virtual Bench (HIL)
Reproducible builds and automated tests for firmware, with and without hardware.
Track 6 · Planned · Tentative Q2 2027
Power-Rail Physics, Battery Operation & Low-Power Design
Where the current really goes, and why devices brown out or drain early.
Track 7 · Planned · Tentative Q3 2027
Post-Mortem Diagnostics, Crash Forensics & Field Telemetry
Turning a crashed device into a root cause, even when it crashed in the field.
Track 8 · Planned · Tentative Q3 2027
Embedded Systems Architecture & Hardware-Firmware Co-Design
Structuring firmware and deciding what belongs in hardware.
Track 9 · Planned · Tentative Q4 2027
Managing Embedded Engineering, Hardware Delays & Silicon Slips
Planning firmware work when the hardware is late, changing or unavailable.
Track 10 · Planned · Tentative Q4 2027
Systems Wisdom, Technical Debt & Defensive Engineering
Habits that keep firmware working when the physical world misbehaves.
Pricing
Prices are in US dollars.Prices are in Indian rupees. Every purchase comes with a GST/VAT invoice your company can reimburse.
All tracks are training and learning material. You’re responsible for evaluating your own system’s specifications and applying the appropriate measures. Training notice
Track
₹4,999$99
Every module in a track as searchable PDF field manuals, with code, register maps and AI prompts.
Tracks are the only thing sold. There are no single-module purchases.
Pre-order
₹3,499$69
30% off any track that’s still being written. Each module is delivered the day it’s released.
The price returns to ₹4,999$99 once every module in the track is out.
All 10 tracks
₹29,999$599 ₹49,990$990
The whole curriculum in one purchase. Tracks still being written are delivered the day they’re released, through Q4 2027.
Free
The AI firmware review pack
10 ready-to-paste prompts, one per track, that make your code assistant check what it usually gets wrong on real hardware. Sent to your inbox now; use them on today’s code.
One email with the pack. Updates only if you leave the box ticked, and every one has an unsubscribe link.
The prompts help you review code; they don’t replace your judgement. Verify every AI answer against your part’s datasheet, errata and your system’s requirements. Training notice
- 01Optimizer check: volatile, strict aliasing and UB that -O2 exploits
- 02Peripheral bring-up check: clocks, errata and bus recovery
- 03Interrupt check: ISR priorities against RTOS syscall limits
- 04Testability check: register access you can mock on the host
- 05Build check: toolchain pinning and warnings that matter
- 06Power check: floating pins, sleep entry and brownout paths
- 07HardFault triage: read CFSR, HFSR and BFAR from a crash dump
- 08Driver design check: layering, ownership and footprint
- 09Schedule risk check: what breaks when the silicon slips
- 10Edge-case review: bounce, brownout and power-loss mid-write
Track 1 / Module 1.1
Stack frames & AAPCS calling conventions
How arguments, return values and saved registers move across a call, and why a corrupted stack looks the way it does.
- Status
- Writing now
- Track release
- Q4 2026 (tentative)
- Included in
- Track 1, ₹3,499$69
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
This module is part of Track 1 and isn’t out yet. Pre-order the track and you get it the day it ships.
All 5 modules in one purchase. 30% off while the track is being written; each module is delivered the day it’s released. A team licence covers 5 engineers at 20% off 5 single licences.
Track 1 / Module 1.2
Strict aliasing & undefined behavior under -O2/-O3
The aliasing and UB rules that let the optimizer delete code that worked at -O0.
- Status
- Planned
- Track release
- Q4 2026 (tentative)
- Included in
- Track 1, ₹3,499$69
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
This module is part of Track 1 and isn’t out yet. Pre-order the track and you get it the day it ships.
All 5 modules in one purchase. 30% off while the track is being written; each module is delivered the day it’s released. A team licence covers 5 engineers at 20% off 5 single licences.
Track 1 / Module 1.3
Custom linker scripts & VMA/LMA address maps
Writing .ld files that place code and data exactly where the silicon needs them, and copying .data from flash at boot.
- Status
- Planned
- Track release
- Q4 2026 (tentative)
- Included in
- Track 1, ₹3,499$69
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
This module is part of Track 1 and isn’t out yet. Pre-order the track and you get it the day it ships.
All 5 modules in one purchase. 30% off while the track is being written; each module is delivered the day it’s released. A team licence covers 5 engineers at 20% off 5 single licences.
Track 1 / Module 1.4
Memory barriers: DMB, DSB, ISB
When the core, the bus and the peripherals see writes in a different order than you wrote them.
- Status
- Planned
- Track release
- Q4 2026 (tentative)
- Included in
- Track 1, ₹3,499$69
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
This module is part of Track 1 and isn’t out yet. Pre-order the track and you get it the day it ships.
All 5 modules in one purchase. 30% off while the track is being written; each module is delivered the day it’s released. A team licence covers 5 engineers at 20% off 5 single licences.
Track 1 / Module 1.5
Disassembly teardown
Reading compiler output line by line to confirm what actually shipped.
- Status
- Planned
- Track release
- Q4 2026 (tentative)
- Included in
- Track 1, ₹3,499$69
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
This module is part of Track 1 and isn’t out yet. Pre-order the track and you get it the day it ships.
All 5 modules in one purchase. 30% off while the track is being written; each module is delivered the day it’s released. A team licence covers 5 engineers at 20% off 5 single licences.
Track 2 / Module 2.1
I2C clock-stretching deadlocks & 9-clock bus recovery
Why a slave holds SDA low after a reset, and the clock-out sequence that frees the bus.
- Status
- Planned
- Track release
- Q4 2026 (tentative)
- Included in
- Track 2
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 2 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q4 2026.
Track 2 / Module 2.2
CAN bit timing & bus-off recovery
Sample points, oscillator tolerance and temperature, and recovering a node that went bus-off.
- Status
- Planned
- Track release
- Q4 2026 (tentative)
- Included in
- Track 2
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 2 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q4 2026.
Track 2 / Module 2.3
ADC noise & ground bounce
Separating real signal from switching noise, sampling-capacitor effects and return-path problems.
- Status
- Planned
- Track release
- Q4 2026 (tentative)
- Included in
- Track 2
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 2 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q4 2026.
Track 2 / Module 2.4
Coding around silicon errata
Reading errata sheets and writing workarounds that survive the next silicon revision.
- Status
- Planned
- Track release
- Q4 2026 (tentative)
- Included in
- Track 2
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 2 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q4 2026.
Track 3 / Module 3.1
WCET & jitter
Measuring and bounding worst-case execution time on real hardware.
- Status
- Planned
- Track release
- Q1 2027 (tentative)
- Included in
- Track 3
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 3 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q1 2027.
Track 3 / Module 3.2
FreeRTOS priority inversion protocols
How inversion happens and what priority inheritance does and doesn’t fix.
- Status
- Planned
- Track release
- Q1 2027 (tentative)
- Included in
- Track 3
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 3 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q1 2027.
Track 3 / Module 3.3
Zero-copy DMA ring buffers
Streaming peripheral data without copies, races or cache surprises.
- Status
- Planned
- Track release
- Q1 2027 (tentative)
- Included in
- Track 3
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 3 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q1 2027.
Track 3 / Module 3.4
Eliminating malloc fragmentation
Static and pool allocation patterns for systems that must run for years.
- Status
- Planned
- Track release
- Q1 2027 (tentative)
- Included in
- Track 3
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 3 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q1 2027.
Track 4 / Module 4.1
Decoupling MMIO registers with Ceedling, Unity & CMock
Making register access testable on the host without rewriting the driver.
- Status
- Planned
- Track release
- Q1 2027 (tentative)
- Included in
- Track 4
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 4 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q1 2027.
Track 4 / Module 4.2
Event state-machine test harnesses
Driving event-driven firmware through every transition from a test.
- Status
- Planned
- Track release
- Q1 2027 (tentative)
- Included in
- Track 4
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 4 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q1 2027.
Track 4 / Module 4.3
Mutation testing
Finding out whether your tests would actually catch a bug.
- Status
- Planned
- Track release
- Q1 2027 (tentative)
- Included in
- Track 4
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 4 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q1 2027.
Track 4 / Module 4.4
Register fault injection
Simulating stuck bits, timeouts and error flags that the bench rarely produces.
- Status
- Planned
- Track release
- Q1 2027 (tentative)
- Included in
- Track 4
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 4 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q1 2027.
Track 5 / Module 5.1
Dockerized cross-compiler environments
Pinning the exact toolchain so every build is reproducible.
- Status
- Planned
- Track release
- Q2 2027 (tentative)
- Included in
- Track 5
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 5 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q2 2027.
Track 5 / Module 5.2
Headless binary tests in QEMU & Renode
Running the real firmware image in CI without a board.
- Status
- Planned
- Track release
- Q2 2027 (tentative)
- Included in
- Track 5
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 5 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q2 2027.
Track 5 / Module 5.3
Static analysis tuning
Configuring analyzers so the warnings that matter aren’t buried.
- Status
- Planned
- Track release
- Q2 2027 (tentative)
- Included in
- Track 5
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 5 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q2 2027.
Track 5 / Module 5.4
Automated HIL test farms
Wiring real boards into CI for the tests emulators can’t cover.
- Status
- Planned
- Track release
- Q2 2027 (tentative)
- Included in
- Track 5
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 5 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q2 2027.
Track 6 / Module 6.1
Battery ESR & inrush current sag
How a radio burst pulls the rail below brownout on a half-empty cell.
- Status
- Planned
- Track release
- Q2 2027 (tentative)
- Included in
- Track 6
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 6 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q2 2027.
Track 6 / Module 6.2
MCU sleep/wake latency economics
When sleeping costs more energy than staying awake.
- Status
- Planned
- Track release
- Q2 2027 (tentative)
- Included in
- Track 6
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 6 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q2 2027.
Track 6 / Module 6.3
Clock gating & floating-pin parasitic leakage
Finding the microamps lost to unclocked peripherals and floating inputs.
- Status
- Planned
- Track release
- Q2 2027 (tentative)
- Included in
- Track 6
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 6 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q2 2027.
Track 6 / Module 6.4
Microamp energy profiling
Measuring sleep current accurately enough to trust a battery-life estimate.
- Status
- Planned
- Track release
- Q2 2027 (tentative)
- Included in
- Track 6
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 6 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q2 2027.
Track 7 / Module 7.1
Cortex-M/R HardFault decoding (CFSR & BFAR)
Reading the fault status registers to find what failed and where.
- Status
- Planned
- Track release
- Q3 2027 (tentative)
- Included in
- Track 7
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 7 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q3 2027.
Track 7 / Module 7.2
Precise vs imprecise bus faults
Why the stacked PC sometimes points at the wrong instruction, and how to find the right one.
- Status
- Planned
- Track release
- Q3 2027 (tentative)
- Included in
- Track 7
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 7 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q3 2027.
Track 7 / Module 7.3
Non-volatile crash loggers
Saving fault state that survives the reset so field crashes can be diagnosed.
- Status
- Planned
- Track release
- Q3 2027 (tentative)
- Included in
- Track 7
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 7 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q3 2027.
Track 7 / Module 7.4
Raw hex call-stack reconstruction
Rebuilding the call chain from a raw memory dump and the ELF.
- Status
- Planned
- Track release
- Q3 2027 (tentative)
- Included in
- Track 7
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 7 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q3 2027.
Track 8 / Module 8.1
Hardware vs software partitioning
Deciding what a peripheral, a timer or the CPU should own.
- Status
- Planned
- Track release
- Q3 2027 (tentative)
- Included in
- Track 8
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 8 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q3 2027.
Track 8 / Module 8.2
Clean C HALs without OOP overhead
Abstraction layers that stay testable without virtual-dispatch costs.
- Status
- Planned
- Track release
- Q3 2027 (tentative)
- Included in
- Track 8
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 8 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q3 2027.
Track 8 / Module 8.3
Flash & RAM footprint reduction
Finding and removing the bytes you don’t need.
- Status
- Planned
- Track release
- Q3 2027 (tentative)
- Included in
- Track 8
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 8 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q3 2027.
Track 8 / Module 8.4
Event-driven architectures
Designing firmware around events and queues instead of polling loops.
- Status
- Planned
- Track release
- Q3 2027 (tentative)
- Included in
- Track 8
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 8 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q3 2027.
Track 9 / Module 9.1
Scheduling around silicon revisions
Planning firmware milestones against Rev A, B and C hardware.
- Status
- Planned
- Track release
- Q4 2027 (tentative)
- Included in
- Track 9
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 9 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q4 2027.
Track 9 / Module 9.2
Decoupling firmware with host mocks & staging
Keeping firmware moving before boards exist.
- Status
- Planned
- Track release
- Q4 2027 (tentative)
- Included in
- Track 9
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 9 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q4 2027.
Track 9 / Module 9.3
Multi-sourcing against obsolescence
Designing so a part shortage doesn’t force a rewrite.
- Status
- Planned
- Track release
- Q4 2027 (tentative)
- Included in
- Track 9
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 9 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q4 2027.
Track 9 / Module 9.4
Bridging the firmware-to-PM gap
Explaining hardware-driven risk in terms a schedule can use.
- Status
- Planned
- Track release
- Q4 2027 (tentative)
- Included in
- Track 9
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 9 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q4 2027.
Track 10 / Module 10.1
Designing for physical edge cases
Contact bounce, brownouts and the inputs no spec mentions.
- Status
- Planned
- Track release
- Q4 2027 (tentative)
- Included in
- Track 10
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 10 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q4 2027.
Track 10 / Module 10.2
Safe refactoring of legacy register code
Changing old driver code without changing what the hardware sees.
- Status
- Planned
- Track release
- Q4 2027 (tentative)
- Included in
- Track 10
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 10 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q4 2027.
Track 10 / Module 10.3
Adversarial peer reviews
Reviewing firmware by asking how the hardware could break it.
- Status
- Planned
- Track release
- Q4 2027 (tentative)
- Included in
- Track 10
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 10 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q4 2027.
Track 10 / Module 10.4
Bypassing vendor HAL bloat
Replacing vendor drivers with direct register code where it pays off.
- Status
- Planned
- Track release
- Q4 2027 (tentative)
- Included in
- Track 10
Path
The step-by-step path for this module is published before it’s released.
Every module includesField manual (PDF)Code and register mapsAI prompts for this topic
Track 10 isn’t on sale yet. It opens for pre-order when writing starts, with release planned for Q4 2027.
I want Track 2 sooner
Hardware-Software Interconnects & Silicon Fault Physics. Tentative Q4 2026.
I want Track 3 sooner
Real-Time Systems, Determinism & Execution Architectures. Tentative Q1 2027.
I want Track 4 sooner
Automated Testing & Register-Level Mocking on Bare Metal. Tentative Q1 2027.
I want Track 5 sooner
Headless CI/CD, Containerized Toolchains & Virtual Bench (HIL). Tentative Q2 2027.
I want Track 6 sooner
Power-Rail Physics, Battery Operation & Low-Power Design. Tentative Q2 2027.
I want Track 7 sooner
Post-Mortem Diagnostics, Crash Forensics & Field Telemetry. Tentative Q3 2027.
I want Track 8 sooner
Embedded Systems Architecture & Hardware-Firmware Co-Design. Tentative Q3 2027.
I want Track 9 sooner
Managing Embedded Engineering, Hardware Delays & Silicon Slips. Tentative Q4 2027.
I want Track 10 sooner
Systems Wisdom, Technical Debt & Defensive Engineering. Tentative Q4 2027.